The last few decades saw an increasing interest in semiconducting copper sulfide thin films, because of their applications in various fields of science and technology. Modification of polymers physical properties by formation on their surfaces of thin layers of inorganic compounds allows obtaining composites with desirable properties. The sheet resistance of the obtained layer varies from 6300 to 102. , was nm and for djurleite,, it was 54.17 nm. For PA 6 initially sulfured 4 h, grain size for chalcocite, It has been established by the XRD method that, beside, the layer contains as Copper XPS spectra analyses showed Cu(I) bonds only in deeper layers of the formed film, while in sulfur XPS S 2p spectra dominating sulfide bonds were found after cleaning the surface with ions. The values of are 1.25 and 1.3 eV for 4 h and 5 h sulfured PA 6 respectively. The copper sulfide layers are indirect band-gap semiconductors. Surface of the polyamide film a layer of copper sulfide was formed. UV/VIS, X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) methods.
After washing and drying, the samples were treated with Cu(I) salt solution. Polymer samples were immersed for 4Īnd 5 h in 0.15 mol ⋅ solutions and acidified with HCl Copper sulfide layers were formed on polyamide PA 6 surface using
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